MILPITAS, Calif., Dec. 6, 2024 /PRNewswire/ -- Destination 2D™ - a new semiconductor startup with unmatched expertise in graphene process technology - today announced it has successfully achieved ...
TeraSignal has announced an intelligent re-driver solution that addresses the rapidly evolving needs for scaling AI bandwidth in data centres. The company’s new TS8401/02 intelligent 400G (4x100G) ...
DARPA, Intel, and Ayar Labs collaborate on developing 100-Tb/s-plus in-package silicon photonic interfaces. Ayar’s TeraPHY chiplet combines silicon photonics and CMOS in a flip-chip SiP. Thermal ...
It's been 20 years since IBM first introduced copper interconnects in CMOS processing, sparking a minor revolution in the process. Within a handful of years, both Intel and AMD had made the jump as ...
Silicon bonding technology promises optimized density, power efficiency, and performance In conjunction with Raytheon Vision Systems, wafer-bonding-process developer Ziptronix (Morrisville, NC) has ...
A CMOS-compatible synthesis technology allows for the direct synthesis of graphene onto wafer-scale dielectric substrates at temperatures significantly below the CMOS thermal budget. All of this is ...
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