A new technical paper titled “Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging” was published by researchers at Sungkyunkwan University and ...

This is somewhat Mac related, but I think it's more of a chip issue (esp on factory-assembled boards), so I figured I'd post here. Basically, I'm having repeated failures of an ATI 4850 graphics card ...

This paper will address the optimization of Pb Free soldering conditions, with a focus on differences between Sn/ Pb and Pb Free soldering. This allows assemblers to build on their extensive ...

Capable of withstanding 260ûC peak solder reflow conditions while meeting JEDED Level-3 standards, Hysol FP4453 dam-and-fill encapsulant is a black, high-viscosity liquid that provides minimum flow ...

Littelfuse Inc. extends its K5V Series of illuminated tactile switches with the release of new K5V4 models including the gull-wing and 2.1-mm pin-in-paste (PIP) versions compatible with reflow ...

Homebrew reflow projects generally follow a pretty simple formula: find a thrift shop toaster oven or hot plate, add a microcontroller and a means to turn the heating element on and off, and close the ...

In a conventional lead-free soldering process reflow ovens operate continuously at about 260°C. An effective alternative capable of operating at a lower temperature could significantly reduce the ...