Richardson, TX (Sept. 22, 2009) – With ASSET® InterTech’s new LGA1366 interposer, design, test and field repair engineers are able to access the debug port on the Intel® Xeon® Processor 5500 Series ...

May 19, 2014. Agilent Technologies Inc. has introduced two new interposer solutions for testing DDR4 and DDR3 DRAM designs with a logic analyzer. Both interposer solutions provide fast, accurate ...

Semiconductor manufacturers are adopting 2.5-D and 3-D technologies to increase the performance and density of their devices through the use of silicon interposers and through-silicon vias (TSVs).

Goal Is More Efficient and Timely Commercialization of Through-Silicon Via (TSV) Technology Using Arteris Network-on-Chip (NoC) Interconnect IP & Tool Products SUNNYVALE, CA-- December 06, 2011-- ...

The miniaturization trend in electronic devices and the rise in smart and IoT device segments make adopting heterogeneous integration of chip components or 3D-ICs a viable option for miniaturization ...

OSATs and ATE vendors are making progress in determining what works and what doesn’t in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. Most experts ...

We make use of a power interposer for power consumption testing. This hardware and software combination is an exact hardware setup that will measure at the 12V rails and the PCIe slot. This isolates ...

Abstract—The market for Semiconductor Intellectual Property is well served for standard process technologies but not all functions are offered in all processes. Mixing and matching high performance ...

We make use of a power interposer for power consumption testing. This hardware and software combination is an exact hardware setup that will measure at the 12V rails and the PCIe slot. This isolates ...

ESCONDIDO, Calif., March 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded ...