A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in ...

The big picture: Taiwan's E&R Engineering is fully committing to glass substrates for advanced packaging. Late last month, the company hosted an event in Taipei to launch its new "E-Core System" ...

Why it matters: AMD may not manufacture its own chips anymore, but that hasn't stopped it from investing in research and custom process technologies for its chips. Now, the company has its sights on ...

A San Francisco startup has raised more than $100 million for technology that could upend the global semiconductor industry—if it proves out. Founded by a protégé of investor Peter Thiel, Substrate ...

Foxconn has secured a major order of chip substrates for Nvidia’s HGX AI servers, supplying over 50% of Nvidia’s total demand, according to an August 14 report by Chinese tech news site IT Home.

Intel says that using glass substrates for chips instead of organic materials should allow for even more transistors to be packed into the same space, but we will have to wait a while for these chips.

Startup Substrate is building next-generation semiconductor fabs using advanced X-ray lithography. This goes beyond extreme ultraviolet 13.5 nanometer wavelengths down to 0.01 nanometers. At the core ...

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