Building electronics in unconventional form factors with high packaging density is possible thanks to three-dimensional circuit designs using flex and rigid-flex printed circuit boards (PCBs).

The plating type is usually immaterial to the footprint geometry but is often incorporated somewhere in the vendor part ...

In today’s electronics industry, compact, efficient, and versatile PCBs are in high demand. Rigid-flex technology allows engineers to design boards that bend and flex without compromising performance ...

Printed circuit boards can be square, round, octagonal, or whatever shape you desire. But there’s little choice when it comes to the third dimension: most PCBs are flat and rigid. Sure, you can make ...

PCB East 2026 brought the electronics industry together for a packed week of learning, networking and reconnecting with familiar faces in Worcester. From busy show floor conversations and technical ...

A new technical paper titled “Computing with Printed and Flexible Electronics” was published by researchers at Karlsruhe Institute of Technology, Pragmatic Semiconductor Ltd and University of Patras. ...

Boise State University researchers have unveiled a cutting-edge approach to manufacturing flexible hybrid circuits - reducing costs, waste, and environmental impact. Their work leverages the ...

A new manufacturing technology has been developed for the continuous production of large-area flexible printed circuit boards ...

Stratos Optical Technologies now offers increased packaging density as a custom manufacturing option for its optical flex circuit products (see figure). The new optical flex circuit design is called ...