Freescale Semiconductor, a manufacturer of embedded semiconductors for the automotive, consumer, industrial and networking markets, announced that it had signed a licensing agreement with Nepes ...

Freescale Semiconductor has developed a new packaging technology that could replace BGA and flip chip as the dominant packaging and assembly approach for highly-integrated semiconductors.

Freescale Semiconductor today announced it is setting up a pilot production line at its facility in Tempe, Ariz., for its redistributed chip packaging (RCP) technology in preparation for volume ...

Freescale Semiconductor has debuted a new technology that the company claims could replace BGA and flip chip as the dominant packaging and assembly approach for advanced semiconductors by ...