TE Connectivity recently unveiled its extra-large array (XLA) socket technology, which provides more reliable performance with 78% better warpage control than traditional molded socket technologies.

Shrinking pitches, smaller solder balls and higher integrated-circuit speeds are driving the biggest advances in ball grid array (BGA) and chip-scale package (CSP) socket technology for burn-in, test ...

Phillips Industries has introduced new single and dual pole liftgate sockets with swivel and automatic disconnect features. Phillips says the S1 and S2 Swivel Sockets are designed to extend the life ...

DENVER--(BUSINESS WIRE)--Xtremity, a premium medical device brand that develops advanced prosthetic socket technology, today announced closing of a Series B3 financing round, totaling $8.1 million ...

DENVER--(BUSINESS WIRE)--Xtremity, a premium medical device maker known for developing cutting-edge prosthetic thermoformable socket technology and the creator of the XtremityTT™ Socket System, today ...

Harrisburg, PA. TE Connectivity (TE) has introduced its new extra-large array (XLA) socket technology, which provides more reliable performance with 78% better warpage control than traditional ...