Key ASIC has deployed Design Compiler Graphical to accelerate the design implementation of its consumer, wireless and personal electronics ICs Comprehensive evaluation of available synthesis tools ...
MOUNTAIN VIEW, Calif., Oct. 22, 2020 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced that its 3DIC Compiler solution enabled Samsung Foundry to design, implement and tape out a complex 5 ...
Broad deployment of Design Compiler Graphical for Samsung Mobile SoCs Reduced routing congestion leads to 10 percent smaller area for highly congested blocks Minimal use of Low-Vt cells reduces ...
Companies Strengthen Collaboration with Successful Tape Out of HBM Customer Design, Certified EDA Flows, and PPA-Optimized IP on Samsung's Advanced Technologies "The adoption of Edge AI applications ...
Certified digital and analog flows on the TSMC N2P and A16â„¢ processes using TSMC NanoFlexâ„¢ architecture boost performance and speed analog design migration 3DIC Compiler platform and 3D-enabled IP ...
SANTA ROSA, Calif--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to ...
Synopsys' Fusion Compiler RTL-to-GDSII solution's unique, single data model-based infrastructure coupled with a single-shell, hyper-converged optimization architecture unlocks optimal PPA potential ...
AMD deploys Synopsys' Fusion Compiler RTL-to-GDSII product for the development of its next-generation processor products Unique, single-data-model architecture and unified, full-flow optimization ...
Synopsys and Samsung have announced its hit first production tapeout of its next-generation flagship mobile CPU on Samsung Foundry's GAA process. The companies announced that they have achieved ...
Additionally, Synopsys strengthened its automotive leadership with the launch of a complete UCIe IP ASILB solution on N5A, complementing its high reliability Interface and Foundation IP offerings on ...
Matsushita used Synopsys' IC Compiler for its first 45-nanometer system-on-chip (SoC) design tapeout, which is now entering volume production. The SoC device, which has more than 250 million ...