Much anticipated TLM-2.0 provides essential framework for standards-based ESL design ANAHEIM, Calif.-- June 09, 2008-- The Open SystemC Initiative (OSCI), an independent non-profit organization ...

OSCI has recently published their TLM-2.0 technology which provides for interoperability between SystemC models of electronic components whose primary interfaces are memorymapped busses. This is a ...

SystemC standards group Open SystemC Initiative (OSCI) has released the SystemC TLM (transaction-level modeling) standard version 1.0. The TLM standard kit, which can be downloaded under an open ...

THAME, England--(BUSINESS WIRE)--The Open Virtual Platforms (OVP) initiative (www.OVPworld.org) has announced the release of a reference virtual platform of the ARM Integrator development board using ...

System-on-chip (SoC) designs commonly consist of one or multiple processors (e.g. DSP or reduced instruction set computing (RISC) processors), interconnects, memory sub-systems, DSP hardware ...

Would-be users of transaction-level models (TLMs) and electronic system-level (ESL) design approaches in general face a major hurdle. Traditionally, it has been difficult to construct TLMs that serve ...

The last several years have seen strong adoption of transaction-level models using SystemC TLM 2.0. Those models are used for software validation and virtual prototyping. For functional verification, ...

In the sometimes-murky waters of system-level modeling standards where real-world adoption can be difficult to track, work is progressing to help hardware and software engineers realize the promise of ...

PISCATAWAY, N.J.--(BUSINESS WIRE)--IEEE, the world's largest professional association advancing technology for humanity, today announced that the IEEE Standards Association (IEEE-SA) Standards Board ...

At the 45th Design Automation Conference in June 2008, the Open SystemC Initiative (OSCI) announced the ratification of the TLM-2.0 standard, enabling interoperability for transaction ...