In particular, a new type of packaging defect phenomenon—die-pop—is observed. Vacuum reflow process has been able to reduce the solder void size to minimum value consistently but there is an ...

Injection molding is a complex manufacturing process, where material behavior during cooling critically influences final part dimensions. Warpage, defined as the deformation from the intended geometry ...

Optimizing speed and time are not only the ingredients to fulfill gold medal aspirations on the Olympic track, but the prerequisites to a robust surface mount (SMT) process of memory to bottom (logic) ...

As advanced packaging moves into the mainstream, packaging houses and equipment makers are ratcheting up efforts to solve persistent metrology and inspection issues. The goal is to lower the cost of ...